Global SMT & Packaging UK & Ireland

Pektron Group Ltd enhances production with six additional Hitachi High-Technologies Sigma Mounters Tuesday, May 21, 2013 Following several years of sustained and unprecedented growth, Pektron Group Ltd enhances its production capacities with important investment in upgrading two production lines to include six Hitachi Sigma Series machines. This increases the total number of Hitachi placement systems to fourteen on site at Pektron’s Derby (UK) manufacturing facility.		Blundell Production Equipment reports successful Technology Week Tuesday, May 21, 2013 Blundell Production Equipment’s Technology Week and mini exhibition, held over 3 days from 14th to 16th May has been reported to have had a higher attendance than any similar event held by the company in previous years. Over 150 industry professionals attended the event which was held at Blundells’ Coventry headquarters. Orders were handed over by customers for four iPulse SMT placement machines and a stencil cleaner, and many more orders are in prospect following the successful show.
Invotec Group appoints new sales account manager for the South East Monday, May 20, 2013 Invotec Group, Europe’s manufacturer of time critical, high technology PCBs, is pleased to announce that John Fitzpatrick has joined the company in the position of Sales Account Manager with responsibility for the South East region. With over 25 years’ experience working with OEMs and CEMs, John has an in-depth understanding of customer requirements, from component to complete system level, across a range of market sectors, including automotive, aerospace, defence, security, rail and electronic manufacturing.		sureCore receives £250K SMART Award to prototype its low power SRAM technology Thursday, May 16, 2013 sureCore Ltd has announced that it has secured a Technology Strategy Board SMART award of £250K to help realise the company’s low power SRAM technology in a leading edge next generation silicon process node.
Season Group to acquire Havant-based Outsource Electronics Limited Thursday, May 16, 2013 Season Group, the global vertically integrated EMS provider, announced that it is in the process of acquiring Outsource Electronics Limited (OEL) in the UK. The deal is expected to be concluded in June. Speaking of the acquisition, Carl Hung, President and COO of Season stated: “We have been working closely with OEL for around 18 months on a number of projects.		Yorkshire Business Insider International Trade Award Monday, May 13, 2013 Premier Farnell has won the Technology Provider category in the Yorkshire Business Insider International Trade Awards. Held at the Royal Armouries Museum in Leeds, Yorkshire, over 200 representatives from businesses across the region attended the awards dinner. This year entrants were required to describe their significant and growing sales outside the UK and explain how they plan to grow their export business. In addition judges were looking at how companies planned to use innovation and meet customer needs in the future.
Etek Europe Ltd. to hold Cleaning & Conformal Coating Technology Day in Scotland Friday, May 10, 2013 Etek Europe Ltd., a leading supplier of products and services to the European electronics industry, today announced that it will hold a Cleaning & Conformal Coating Technology Day on Wednesday, June 26, 2013 at the new Etek Technology Centre in Scotland. Cleaning experts from respected companies including Aqueous Technologies, Humiseal, Specialty & Coating Systems and Zestron will present. Food and drinks will be provided and the day will conclude with a tour of the new Technology Centre.		Keynotes for the annual 2013 SMART Group European Conference to focus on the theory & practice of improving efficiency to win business Tuesday, May 7, 2013 SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that its annual SMART Group European Conference & Table Top Exhibition will be held from 2-3 October 2013 at the Spread Eagle Hotel in Cornmarket Thame, Oxfordshire, England. The business cycle is turning with good signs that the rush to off-shore manufacturing is being reversed.

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High speed web inspection for laser-machined holes Wednesday, May 22, 2013 Olmec-UK has partnered with web handling specialists, Universal Converting Equipment Ltd, to produce a vision system capable of real-time measurement of laser machined holes in film. The vision system is mounted directly onto the web, which runs at 350m/min. Lasers are used to perforate the extruded web material with hole sizes from 30 – 120 µm depending on the particular requirement.		Farnell element14 launches wireless measurement device from Fluke Tuesday, May 21, 2013 Farnell element14 announces it will stock the Fluke CNX3000 wireless multimeter, which allows the user to solve problems faster and manage results from multiple sources. Part of the new Fluke wireless troubleshooting team, the CNX3000 gives visibility of live measurements from multiple modules simultaneously and remotely on a single screen.
element14 launches Raspberry Pi eye to the world Tuesday, May 14, 2013 The eagerly anticipated Raspberry Pi camera board is making its debut with element14 enabling pictures and video to be taken with the Raspberry Pi which can be used for security and VoIP projects as well as image and video capture. One of a strong pipeline of exclusive Raspberry Pi accessories to be launched this year, the camera board, which retails at $25 is available through Newark element14 and MCM in North America, Farnell element14 in Europe, CPC in the UK and Ireland and element14 in Asia Pacific.		IMB-171 low cost Mini-ITX SBC for high volume embedded applications Tuesday, April 30, 2013 The competitively priced IMB-171 Mini-ITX motherboard is the latest product to be added to The BVM Group’s extensive portfolio of industrial grade SBCs. Manufactured by ASRock Industrial it is based on the Q77 chipset and supports Intel Core i7/i5/i3/Celeron Sandy Bridge and Ivy Bridge processors in the LGA1155 socket. Two 204 pin slots accept up to 16GB of Dual Channel DDR3 1066/1333/1600 MHz SDRAM; two SATAII 3.0Gb/s and two SATAIII 6.0Gb/s ports support RAID 0/1/5 configuration hard drives.
High speed X-ray TDI camera for demanding inspection applications Friday, April 19, 2013 Hamamatsu Photonics are pleased to announce a brand new device for low level X-ray imaging, the C12200-321 X-ray TDI (Time Delay Integration) camera. This new camera is designed for high speed inspection of moving objects. Compared to conventional X-ray line-scan cameras using CMOS arrays, the TDI CCD at the heart of the C12200-321 provides greater sensitivity, high resolution (sub 50 micron pixel size) and high dynamic range.		Electrically conductive polyurethane adhesive - Polytec PU 1000 from Intertronics Thursday, April 11, 2013 Adhesives specialists Intertronics are delighted to announce availability of Polytec PU 1000, an electrically conductive polyurethane which addresses applications in die attach, bonding of components in hybrid circuit applications and surface mount technology (SMT); areas where silver filled electrically conductive adhesives have been used for many decades.
Hamamatsu new dual mode X-ray image intensifier Wednesday, March 27, 2013 Hamamatsu Photonics produce a range of technologies for real time X-ray imaging and X-ray crystallography. The new V10905P is a dual mode X-ray image intensifier, offering both 4 inch and 2 inch modes. When used in 2 inch mode, the reduced field of view produces a very high magnification whilst maintaining both high contrast and high resolution. The V10905P is compatible with a wide range of analogue and digital cameras.		Hamamatsu Photonics radiation detector module Wednesday, March 27, 2013 Hamamatsu Photonics introduce the new C12137, a compact, high sensitivity radiation detector module using Hamamatsu’s unique Multi-Pixel Photon Counting (MPPC) technology. The C12137 is a gamma ray detector containing a scintillator crystal coupled to an MPPC sensor. The scintillator converts incident gamma rays into visible light and the MPPC then detects the converted light.

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Microelectronics in adhesives dispensing electronics Tuesday, January 15, 2013 These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.		Cost factors of the cleaning process—part 1 Monday, November 7, 2011 Companies are constantly striving to reduce costs incurred during electronics production in order to increase cost effectiveness.
A review of halogen/halide-free test methods and classifications for soldering materials Monday, October 31, 2011 Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials.		Improved efficiency using root cause failure analysis Monday, October 31, 2011 A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?
Bare board contamination Wednesday, September 28, 2011 Technology and processing developments within SMT are moving bare board cleaning from a nice-to-have feature to an absolute necessity if yields are to be protected and/or improved.		Are factories efficient? Wednesday, September 28, 2011 There are all sorts of ways of defining efficiency and there are all sorts of ways of trying to become efficient.
X-ray inspection of semiconductor devices that use copper wire interconnections Monday, August 29, 2011 Copper wire is increasingly being used to replace gold as the interconnection of choice. This article discusses the use of x-ray inspection to check for the presence and alignment of interconnection wires.		Solder paste stencil manufacturing methods & their impact on precision and accuracy Monday, August 29, 2011 Stencil positional accuracy is a function of the manufacturing process (Machines, Methods, Materials and Men). The various parameters that influence positional accuracy will be discussed.

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Nordson DAGE launches the new Jade FP X-ray inspection system at NEPCON China Tuesday, April 23, 2013 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announced the launch of its new and improved Jade FP X-ray Inspection System today in stand 1H68 during NEPCON China 2013 at the Shanghai World EXPO Exhibition & Convention Center. After the covers were removed from the system the show attendees had the first chance to experience its unique technology and learn how it provides superior X-ray image quality for all X-ray inspection applications in the value oriented market segment.		Nordson DAGE to bring solutions for live imaging and demanding applications to SMT/Hybrid/Packaging Thursday, March 21, 2013 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Electronics test & assembly systems specialist GEN3 SYSTEMS distributed by Stannol GmbH booth 9-430 featuring: Wednesday, March 20, 2013 GEN3 have recently been appointed the Exclusive Global Distribution rights for Aprotec Instrumentation and here at SMT Nuremburg Stannol will be launching the SolderSaver™, a system that rapidly recycles solder dross. Amongst their product line is also the Z-Check 3D Solder Paste Inspection System, which is the latest in Aprotec’s well-established Z-Check range.		Electrolube debuts new SMT products, thermal management and coating solutions at SEMICON China Monday, March 18, 2013 Electrolube, the specialist manufacturer of high performance chemicals for the electronics and electrical manufacturing industries, will launch a new generation conformal coating, thermal management solutions and surface mount products at SEMICON China. As one of the world’s foremost experts in conformal coatings and with environmental responsibility at the core of its ethos, Electrolube will use SEMICON China as a platform to highlight the latest advances in chemicals for the Chinese electronics industry.
DEK presence at NEW Show series highlights flexible, future-proofed printing solutions Thursday, March 14, 2013 Leading global print process innovator DEK will take its latest technology solutions to customers across the United Kingdom at three National Electronics Week (NEW) events in Manchester (20 - 21 March), Edinburgh (1 - 2 May) and Bristol (25 - 26 September). DEK will highlight technologies relevant to its local customer base as well as attracting attendees from across various electronics disciplines..		MicroCare® successfully launches its unique VOC-Free Flux Remover UltraClean™ to the European Market at the Southern Manufacturing & Electronics Show Wednesday, February 20, 2013 Engineered as the best choice for multinational companies, VOC-Free Flux Remover UltraClean features ingredients that are approved for use anywhere in the world. It also has been engineered for use with the MicroCare TriggerGrip™ cleaning system, for a faster, safer, and more economical process of cleaning printed circuit boards at the workbench.
First showing for Quality Station inspection system at Total 2013 Stand H67, Total 2013, NEC, Birmingham UK, 4-6 June 2013 Tuesday, February 19, 2013 Vision systems integrator, Olmec, will be showing the Quality Station (QS) turnkey, self-contained in-line vision inspection system for the first time at Total 2013. Typical applications for the QS include checking for product assembly completeness, colour or defect analysis, as well as label inspection. With a footprint of just 1.2 m x 0.7 m and an integral transport and reject mechanism, the QS can also be used on a manufacturing line in conjunction with other quality inspection tools such as checkweighers.		DEK future-proofed technology on show at Southern Manufacturing & Electronics Monday, February 11, 2013 Addressing the manufacturing requirements of attendees to this year’s Southern Manufacturing & Electronics exhibition in Farnborough, England on 13 and 14 February, DEK will demonstrate many of its future-proofed technology innovations – all designed to satisfy the requisites of today’s high-mix, low-volume manufacturers.

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Lastest Videos Most Viewed Highest Rated

Nordson Dage At SMT Hybrid Packaging 2013

Added: 2013-05-17

Component Damage

Added: 2013-04-03

Dewetting

Added: 2013-04-03

Wire Corrosion

Added: 2013-04-03

Solder Spots

Added: 2013-04-03

Dendrites

Added: 2013-04-03

Cleaning Surface Finishes

Added: 2013-04-03

Bob Willis And Keith Bryant At IPC/ NPL Cleaning & Contamination Testing Center, APEX 2013

Added: 2013-03-27

Nordson Dage Introducing Their New Higher Specification Ruby Flat Panel X-Ray System At APEX 2013

Added: 2013-03-27

Semblant At SMTAi 2012

Added: 2012-11-05

Nordson Dage At SMTAi 2012

Added: 2012-11-05

Cleaning Debate

Added: 2012-07-23

Events News

International Conference on Flexible and Printed Electronics: 3rd call for papers Monday, May 13, 2013

The 2013 International Conference on Flexible and Printed Electronics (ICF...

Nordson DAGE launches the new Jade FP X-ray inspection system at NEPCON China Tuesday, April 23, 2013

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announced the ...

Nordson DAGE to bring solutions for live imaging and demanding applications to SMT/Hybrid/Packaging Thursday, March 21, 2013

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces it...

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Show Central

IPC APEX Expo 2013: Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org

Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.
NEPCON South China 2012: NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More
Visit our Show Central area for NEPCON South China 2012 to see what's in store on the show floor.
For more details on NEPCON South China 2012, please visit www.nepconsouthchina.com
SMTA International Electronics Exhibition 2012: SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
Visit our Show Central area for SMTAI 2012 to see what's in store on the show floor.
Productronica 2011: Productronica is the world’s leading international trade fair for innovative electronics production. It is the only event of its kind that covers the complete range of current and forward-looking products, technologies and system solutions in their entire breadth and depth and along the entire value-added chain. As a result, it is the industry's largest and most important gathering. Held November 15-18, 2011 in Nuremberg, Germany. Visit our Productionica show page to see what's instore on the show floor.
NEPCON China 2012: Thank you for your participation at NEPCON China 2012.

This is the 2nd reminder of onsite noise control for your kind attention.

As part of our customer service program, we would like to seek your support and co-operation to control the sound level of your speakers and audio/visual display

in your booth in order to ensure a smooth and successful event:

Please ensure that sound level of your booth is being controlled below 75 decibel. It should not cause any interference or annoyance to visitors or other Exhibitors.

Please also place your speakers and other sound devices in a position where direct sound will be channeled into your booth and not the aisles.

The Organizer will reserve the right to reduce the sound level or switch off audio / visual displays causing problems if the sound level is over 75 decibel.

We urge your best understanding and cooperation on the above rules, which is to ensure we jointly build a friendly and comfortable environment for your own business networking on-site.

Thank you very much for your kind attention. Should you have any further inquiries, please feel free to contact your Reed representatives or our customer servicing hot line at: 86 21 2231 7015.

We wish you all the best at NEPCON China 2012.

Visit our show central area for NEPCON China 2012 to see what's in store.
SMT Hybrid Packaging: SMT Hybrid Packaging celebrates 25th anniversary
In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm

Visit our show central area for SMT Hybrid Packaging 2012 to see what's in store.

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